The Universal-300 T is a leading 12-inch CMP equipment developed based on the advanced CMP equipment of Hwatsing and according to the industry's cutting-edge technology requirements. The equipment is based on the innovative technology of the independent intellectual property rights of Hwatsing, equipped with polishing units with superior performance, integrated with a variety of endpoint detection technologies, and equipped with more advanced combined cleaning technology, showing a better cleaning effect. This equipment can realize the global flattening of wafer at nanometer level, meet the requirements of advanced manufacturing technology, and is widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon chips, etc.

The Universal-300 X is an advanced 12-inch CMP device developed for the current high-end market. The equipment uses Hwatsing's innovative technology with independent intellectual property rights, is equipped with superior performance polishing and cleaning units, and integrates a variety of advanced endpoint detection technologies. The equipment is efficient and stable, and the process combination is flexible, which can realize the global flattening of the wafer at the nanometer level, meet the needs of advanced manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.

The Universal-300 Dual is a mature 12-inch CMP device developed based on the innovative technology of Hwatsing's independent intellectual property rights. The equipment is equipped with multiple sets of polishing units and cleaning units with superior performance, integrates a variety of advanced end-point detection technologies, and has excellent process adjustability and stability. It can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafers and other manufacturing processes.

The Universal-300 E is a mature 12-inch CMP device developed for the mid-to-high end market. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, integrated with a variety of advanced endpoint detection technology. The device has excellent process stability and high production efficiency, can achieve ultra-high wafer surface flatness, meet the needs of mature process technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.

The Universal-300 B is a 12-inch CMP device based on innovative technology developed by Hwatsing with independent intellectual property rights. The device is equipped with superior performance polishing units, compatible with 4/6/8/12 inch wafers, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has a small footprint, high cost performance advantages, can meet the needs of mature process technology, widely used in silicon wafer, third generation semiconductor, MEMS and other manufacturing processes.

Universal-200 is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing units with superior performance, compatible with 4/6/8/inch wafers, suitable for a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in silicon wafers, third-generation semiconductors, MEMS and other manufacturing processes.

Universal-200 D is a mature 8-inch CMP device developed on the basis of innovative technology with independent intellectual property rights of Hwatsing. The equipment is equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, applicable to a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in manufacturing processes such as silicon wafers, third-generation semiconductors, MEMS, Micro LED, etc.

Universal-200 Smart is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, high output, stable performance, flexible process combination, can achieve ultra-high flatness of wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, silicon wafers, third-generation semiconductors, MEMS, Micro LED and other manufacturing processes.

The Universal-150 Smart is a mature 6-inch CMP device developed according to the current market requirements. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, compatible with 6/8 inch wafer, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has the advantages of flexible process matching and high yield, to meet the needs of mature process technology, widely used in the third generation semiconductor, MEMS and other manufacturing processes.

Versatile-GP300 is an advanced 12-inch ultra-precision wafer grinding equipment developed according to the current high-end market demand of 3D IC manufacturing, advanced packaging and so on. The equipment integrates advanced ultra-precision grinding, CMP and post-cleaning technology through the innovative layout of the new complete machine, and is equipped with excellent thickness deviation and surface defect control technology. It can provide a variety of system function expansion options, with the advantages of high precision, high rigidity, and flexible process development. Versatile-GP300 can flexibly expand and develop a variety of configurations, which greatly meets the needs of ultra-precision wafer thinning technology in 3D IC manufacturing, advanced packaging and other fields.

Versatile-GM300 is an ultra-precision wafer grinding device innovatively developed for the packaging field. The equipment adopts a new layout, which can realize ultra-precision grinding and stress removal on the back of thin wafer; It is compatible with 8/12 inch wafers, and is equipped with a wafer laminating machine for online use, which can realize the whole process of automatic operation from precise thinning, cleaning and drying to sticking the material ring and back film stripping; The highly reliable wafer handling system effectively reduces the risk of thin wafer damage. Relying on the excellent online thickness measurement and surface defect control technology, the equipment has the advantages of high precision, high rigidity, flexible process development, etc., and meets the needs of thin wafer processing in the packaging field.

HSDS series grinding fluid supply system adopts modular design, customization, flexible configuration, online proportioning system with real-time, high precision, which can realize parameters such as concentration, flow, pressure closed loop control, meet the semiconductor manufacturing process of wet process equipment such as grinding fluid supply demand, convenient operation and maintenance, high reliability, safety and low maintenance cost, flexible configuration, etc.

HCDS series chemical supply system, adopting modular design, customization, flexible configuration, online proportioning system with real-time, high precision, which can realize closed loop control parameters, meet the wet process equipment in the process of semiconductor manufacturing chemicals such as cleaning fluid supply demand, convenient operation and maintenance, high reliability, safety and low maintenance cost, flexible configuration, etc.

HBC-E3500 is a wet Bench clean system independently developed by Hwatsing based on market development frontier and customer demand，With strong compatibility, support a variety of process formula mixed operation. It adopts customized, modular design and flexible configuration to meet the process requirements of different customers.

HCC-3080S is a clean system for 4/6/8/12 inch wafer container, it adopts Hwatsing's innovative technology, equipped with superior performance water recovery device, its unique two-door design enables independent loading and removal of the cassettes before and after cleaning, with the advantages of high environmental protection and low consumption.

HSC-S3810 is a brush clean system developed according to the industry's cutting-edge technology, it’s based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior parameter closed-loop control system, it also has front, back and edge cleaning functions, and can achieve damage free cleaning. HSC-S3810 covers an area of small, high output.

HSC-S1300 is a brush clean system mainly used in 4/6/8-inch compound semiconductors developed by Hwatsing for market demand,it features front and back scrubs and integrates superior cleaning and drying technology. In addition, it’s also compatible with acid solution cleaning/alkaline solution cleaning, transparent/opaque chip cleaning.

HSC-F3400 is a high-performance equipment developed by Hwatsing for the special needs of the large silicon wafer final clean market. It features excellent particle and metal contamination control systems, innovative cleaning and drying modules, and high-performance chuck holding technology.

Film metrology equipment is based on the principle of eddy current non-contact measurement, it works efficiently, and can be measured without damage. It has high precision, reliable and accurate measurement results, and the measurement data can be processed automatically. The equipment is mainly used in Cu, Al, W, Co and other metal processes.