HSC-F3400 is a high-performance equipment developed by Hwatsing for the special needs of the large silicon wafer final clean market. It features excellent particle and metal contamination control systems, innovative cleaning and drying modules, and high-performance chuck holding technology.
Apply to 12-inch silicon wafer post CMP final cleaning process
Capable of frontside and backside cleaning simultaneously
Advanced Particle and Metal Contamination control technology
High reliability and security,low maintenance cost