HSC-S1300 is a brush clean system mainly used in 4/6/8-inch compound semiconductors developed by Hwatsing for market demand,it features front and back scrubs and integrates superior cleaning and drying technology. In addition, it’s also compatible with acid solution cleaning/alkaline solution cleaning, transparent/opaque chip cleaning.
Mainly used for 4/6/8-inch compound semiconductor wafer cleaning process
Capable of frontside and backside cleaning by brush
Capable of Dry in/Dry out or Wet in/Dry out function
Compatible with acidic and alkaline cleaning
Compatible with transparent and opaque wafers